Wafer type compact ball valve

Wafer type compact ball valve introduction
Wafer type compact ball valve has the advantages of short structure length, light weight, convenient installation and material saving.Wafer type compact ball valve is suitable for short line pipe and special space installation and use, with compact structure,short length,small volume, Wafer type compact ball valve seat and flange end face distance is close, less material retention, superior sealing performance and other characteristics.

Wafer type compact ball valve seat use the elastic sealing structure, the sealing is reliable, opens and closes easily.With fire-resistant structure, in case of fire,Wafer type compact ball valve can still operate reliably and have good sealing. According to the needs of users, anti-static structure can be set.The switch with hole positioning plate is set, which can be locked according to the need to prevent misoperation.

Wafer type compact ball valve choose different material, can be respectively suitable for water, steam, oil, nitric acid, acetic acid, oxidizing medium, urea, and other media.

Wafer type compact ball valve Performance parameter
Nominal size: DN15~300mm
Nominal pressure: 1.0Mpa-100Mpa,CL150,CL300,CL600
Connection: ultra-thin flange type, sandwiched type
Structural form: straight through
Spool type: O - type spool
Flow characteristics: fast opening characteristics
Spool material: WCB,304, 316, A105, F304, F316, etc
Sealing materials: PTFE, PPL, metal sealing 
Body design: straight cast ultra short ball valve
Wafer type short pattern ball valveBody material:WCB,304, 316, A105, F304, F316, etc
Temperature range: PTFE: ≤150°C, PPL: ≤200°C, hard seal: ≤450°C
Applicable temperature: -17°C~450°C
Wafer type short pattern ball valve Type of drive: manual,electric,pneumatic
Applicable medium: Forged steel short part wafer ball valve is used in all kinds of pipeline, used to cut off or connect the medium in the pipeline, choose different materials, can be respectively applicable to water, steam, oil, nitric acid, acetic acid, oxidizing medium, urea and other medium.